Rogers RT/duroid 6006 High Frequency PCB on 25mil, 50mil, and 75mil Coating with Immersion Gold and Green Mask for Ground Radar Warning
(Printed Circuit Boards are custom-made products; the images and specifications shown are for reference only.)
Hello Everyone,
Today, we will discuss the Rogers 6006 PCB.
Rogers RT/duroid 6006 microwave laminates are ceramic-PTFE composites designed for electronic and microwave circuit applications that require a high dielectric constant. The RT/duroid 6006 laminate offers a dielectric constant of 6.15.
PCB Capability (RT/duroid 6006)
PCB Material |
Ceramic-PTFE composite |
Designator |
RT/duroid 6006 |
Dielectric Constant |
6.15 ±0.15 (process), 6.45 (design) |
Layer Count |
1 Layer, 2 Layer |
Copper Weight |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB Thickness |
10mil (0.254mm), 25mil (0.635mm), |
50mil (1.27mm), 75mil (1.90mm) |
|
PCB Size |
≤400mm x 500mm |
Solder Mask |
Green, Black, Blue, Yellow, Red, etc. |
Surface Finish |
Bare Copper, HASL, ENIG, Immersion Tin,Immersion Silver, OSP |
RT/duroid 6006 microwave laminates are known for their ease of fabrication and stability in use. These properties facilitate mass production and reduce costs. The laminates feature tight control over dielectric constant and thickness, low moisture absorption, and excellent thermal-mechanical stability.
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Features and Benefits
1.High Dielectric Constant: Enables circuit size reduction.
2.Low Loss: Ideal for applications operating at X-band or below.
3.Tight DK and Thickness Control: Ensures repeatable circuit performance.
Typical Applications
Aircraft collision avoidance systems
Ground radar warning systems
Patch antennas
Satellite communication systems
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Thank you for reading!
Appendix: Properties of RT/duroid 6006 Laminates
RT/duroid 6006 Typical Value |
|||||
Property |
RT/duroid 6006 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
6.15±0.15 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 Clamped stripline |
Dielectric Constant,εDesign |
6.45 |
Z |
|
8GHz to 40 GHz |
Differential Phase Length Method |
Dissipation Factor,tanδ |
0.0027 |
Z |
|
10 GHz/A |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of ε |
-410 |
Z |
ppm/℃ |
-50℃-170℃ |
IPC-TM-650 2.5.5.5 |
Volume Resistivity |
7 x 107 |
|
Mohm.cm |
A |
IPC 2.5.17.1 |
Surface Resistivity |
2 x 107 |
|
Mohm |
A |
IPC 2.5.17.1 |
Tensile Properties |
ASTM D638 (0.1/min. strain rate) |
||||
Young's Modulus |
627(91) 517(75) |
X Y |
MPa(kpsi) |
A |
|
Ultimate Stress |
20(2.8) 17(2.5) |
X Y |
MPa(kpsi) |
A |
|
Ultimate Strain |
12 to 13 4 to 6 |
X Y |
% |
A |
|
Compressive Properties |
|
ASTM D695 (0.05/min. strain rate) |
|||
Young's Modulus |
1069 (115) |
Z |
MPa(kpsi) |
A |
|
Ultimate Stress |
54(7.9) |
Z |
MPa(kpsi) |
A |
|
Ultimate Strain |
33 |
Z |
% |
|
|
Flexural Modulus |
2634 (382) 1951 (283) |
X |
MPa(kpsi) |
A |
ASTM D790 |
Ultimate Stress |
38 (5.5) |
X Y |
MPa(kpsi) |
A |
|
Deformation under load |
0.33 2.1 |
Z Z |
% |
24hr/50℃/7MPa 24hr/150℃/7MPa |
ASTM D261 |
Moisture Absorption |
0.05 |
|
% |
D48/50℃ 0.050"(1.27mm) thick |
IPC-TM-650 2.6.2.1 |
Thermal Conductivity |
0.49 |
|
W/m/k |
80℃ |
ASTM C518 |
Coefficient of Thermal Expansion |
47 |
X |
ppm/℃ |
23℃/50% RH |
IPC-TM-650 2.4.41 |
Td |
500 |
|
℃ TGA |
|
ASTM D3850 |
Density |
2.7 |
|
g/cm3 |
|
ASTM D792 |
Specific Heat |
0.97(0.231) |
|
j/g/k |
|
Calculated |
Copper Peel |
14.3 (2.5) |
|
pli (N/mm) |
after solder float |
IPC-TM-650 2.4.8 |
Flammability |
V-0 |
|
|
|
UL 94 |
Lead-free Process Compatible |
Yes |
|
|
|
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